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PC3SH11YFZ Series
PC3SH11YFZ Series
VDRM : 600V, Reinforced insulation type Non-zero cross type DIP 4 pin Phototriac Coupler for triggering
Zero cross type is also available. (PC3SH21YFZ Series)
Description
PC3SH11YFZ Series reinforced insulation type Phototriac Coupler include an infrared emitting diode (IRED) optically coupled to an output Phototriac. These devices feature full wave control and are ideal isolated drivers for medium to high current Triacs. DIP package provides 5.0kV isolation from input to output with superior commutative noise immunity.
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. 3SH11) 2. Approved by CSA, file No. CA95323 (as model No. 3SH11) 3. Approved by BSI : BS-EN60065, file No. 6690/BSEN60950, file No. 7421, (as model No. 3SH11) 4. Approved by SEMKO, EN60065/EN60950, file No. 0226022 (as model No. 3SH11) 5. Approved by DEMKO, EN60065/EN60950, file No. 311791 (as model No. 3SH11) 6. Approved by FIMKO, EN60065/EN60950, file No. 18937 (as model No. 3SH11) 7. Approved by VDE () (DIN EN 60747-5-2), file No. 40008087 (as model No. 3SH11) 8. Package resin : UL flammability grade (94V-0)
()
Features
1. High repetitive peak off-state voltage (VDRM : 600V) 2. Non-zero crossing functionality 3. IFT ranks available (see Model Line-up section in this datasheet) 4. 4 pin DIP package 5. Reinforced insulation type (MIN. 0.4mm internal separation) 6. Superior noise immunity (dV/dt : MIN. 1 000V/s) 7. Lead-free components are also available (see Model Line-up section in this datasheet) 8. Double transfer mold construction (Ideal for Flow Soldering) 9. High isolation voltage between input and output (Viso(rms) : 5.0kV)
DIN EN60747-5-2 : successor standard of DIN VDE0884. Up to Date code "RD" (December 2003), approval of DIN VDE0884. From Date code "S1" (January 2004), approval of DIN EN60747-5-2.
Applications
1. Triggering for Triacs used to switch on and off devices which require AC Loads. For example heaters, fans, motors, solenoids, and valves. 2. Triggering for Triacs used for implementing phase control in applications such as lighting control and temperature control (HVAC). 3. AC line control in power supply applications.
Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A07201EN Date Mar. 31. 2004 (c) SHARP Corporation
PC3SH11YFZ Series Internal Connection Diagram
1 4 1 2 3 4 2 3
Anode Cathode Anode/Cathode Cathode/Anode
Outline Dimensions
1. Through-Hole [ex. PC3SH11YSZ]
Anode mark 1.20.3 0.60.2
Rank mark Factory identification mark
(Unit : mm) 2. Wide Through-Hole Lead-Form [ex. PC3SH11YFZ]
Rank mark Factory identification mark Date code (2 digit)
1 4
Anode mark 1.20.3 0.60.2
Date code (2 digit)
4.580.5
1
4
2
3
1.00.1
3 S H11 4
6.50.5 7.620.3
2
3SH 11 4
6.50.5 7.620.3
3
4.580.5 2.540.25 VDE identification mark 4.580.5 3.50.5 0.260.1
Model No.
2.540.25
VDE identification mark 4.580.5 0.5TYP. 3.50.5
Model No.
Epoxy resin 0.26
0.1
2.70.5
3.00.5
2.7MIN.
Epoxy resin 10.160.5 0.50.1
0.50.1 : 0 to 13
Product mass : approx. 0.23g 3. SMT Gullwing Lead-Form [ex. PC3SH11YIP]
Anode mark 1.20.3
0.2
Product mass : approx. 0.23g 4. Wide SMT Gullwing Lead-Form [ex. PC3SH11YUP]
Rank mark
Rank mark Factory identification mark
Anode mark 1.20.3
0.2
Factory identification mark Date code (2 digit)
0.6
1
4
0.6
Date code (2 digit)
1
4
4.580.5
2
1.0
3 SH11 4
6.50.5
3
2
0.1
3SH 11 4
6.50.5 7.620.3 0.250.25
3
0.25
7.620.3
0.1
4.580.5 3.50.5
2.540.25
Model No.
VDE identification mark
Model No.
2.54
4.580.5 VDE identification mark 4.580.5 3.50.5 0.50.1 0.750.25
Sheet No.: D2-A07201EN
0.26
0.35
1.0+0.4 -0
Epoxy resin 10.0+0 -0.5
1.0+0.4 -0
2.540.25
Epoxy resin 0.750.25 10.160.5 12.0MAX
Product mass : approx. 0.21g
Product mass : approx. 0.22g
2
0.260.1
0.25
PC3SH11YFZ Series Date code (2 digit)
1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M * * N * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D
A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001
Mark P R S T U V W X A B C * * *
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark no mark Japan Indonesia Philippines China
* This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production.
Country of origin
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A07201EN
3
PC3SH11YFZ Series
Absolute Maximum Ratings
Parameter Symbol Rating IF 50 Forward current Input VR 6 Reverse voltage IT(rms) 0.1 RMS ON-state current *3 Output Peak one cycle surge current 1.2 Isurge 600 VDRM Repetitive peak OFF-state voltage *1 5.0 Viso(rms) Isolation voltage -30 to +100 Topr Operating temperature -55 to +125 Tstg Storage temperature *2 270 *4 Tsol Soldering temperature
*1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s *3 f=50Hz sine wave *4 Lead solder plating models: 260C
(Ta=25C) Unit mA V A A V kV C C C
Soldering area
Electro-optical Characteristics
Parameter Forward voltage Input Reverse current Repentitive peak OFF-state current ON-state voltage Output Holding current Critical rate of rise of OFF-state voltage Rank A Transfer Minimum trigger current Rank B characIsolation resistance teristics Turn-on time Symbol VF IR IDRM VT IH dV/dt IFT RISO ton Conditions IF=20mA VR=3V VD=VDRM IT=0.1A VD=6V - VD=1/2 *VDRM VD=6V, RL=100 DC500V,40 to 60%RH VD=6V, RL=100, IF=20mA MIN. TYP. - 1.2 - - - - - - 0.1 - 1 000 2 000 - - - - 5x1010 1011 - -
1mm
(Ta=25C) MAX. 1.4 10 1 3.0 3.5 - 10 7 - 100 Unit V A A V mA V/s mA s
Sheet No.: D2-A07201EN
4
PC3SH11YFZ Series
Model Line-up (1) (Lead-free components)
Lead Form Shipping Package DIN EN60747-5-2 Model No. Approved PC3SH11YSZAF PC3SH11YSZBF Through-Hole SMT Gullwing Sleeve 50pcs/sleeve Approved PC3SH11YIZAF PC3SH11YIZBF Wide Through-Hole Rank mark Approved PC3SH11YFZAF PC3SH11YFZBF A B MAX.10 MAX.7 IFT[mA] (VD=6V, RL=100)
Lead Form Shipping Package DIN EN60747-5-2 Model No.
Wide SMT Gullwing Sleeve 50pcs/sleeve Approved PC3SH11YUZAF PC3SH11YUZBF
SMT Gullwing
Wide SMT Gullwing Taping 2 000pcs/reel Rank mark Approved PC3SH11YUPAF PC3SH11YUPBF A B MAX.10 MAX.7 IFT[mA] (VD=6V, RL=100)
-
Approved PC3SH11YIPAF PC3SH11YIPBF
-
Model Line-up (2) (Lead solder plating components)
Lead Form Shipping Package DIN EN60747-5-2 Model No. Approved PC3SH11YSZA PC3SH11YSZB Through-Hole SMT Gullwing Sleeve 50pcs/sleeve Approved PC3SH11YIZA PC3SH11YIZB Wide Through-Hole Rank mark Approved PC3SH11YFZA PC3SH11YFZB A B MAX.10 MAX.7 IFT[mA] (VD=6V, RL=100)
Lead Form Shipping Package DIN EN60747-5-2 Model No.
Wide SMT Gullwing Sleeve 50pcs/sleeve Approved PC3SH11YUZA PC3SH11YUZB
SMT Gullwing
Wide SMT Gullwing Taping 2 000pcs/reel Approved PC3SH11YUPA PC3SH11YUPB
Rank mark
IFT[mA] (VD=6V, RL=100) MAX.10 MAX.7
-
Approved PC3SH11YIPA PC3SH11YIPB
A B
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A07201EN
5
PC3SH11YFZ Series Fig.1 Forward Current vs. Ambient Temperature
70 RMS ON-state current Ir (rms) (mA) -30 0 50 100 60 Forward current IF (mA) 50 40 30 20 10 0 Ambient temperature Ta (C)
Fig.2 RMS ON-state Current vs. Ambient Temperature
175 150 125 100 75 50 25 0 -30 0 50 100 Ambient temperature Ta (C)
Fig.3 Forward Current vs. Forward Voltage
Fig.4 Minimum Trigger Current vs. Ambient Temperature
10 9 Minimum trigger current IFT (mA) 8 7 6 5 4 3 2 1 VD=6V RL=100
100 Forward current IF (mA) 50 Ta=75C 50C 10 5 25C 0C -25C
1 0.9
1
1.1
1.2
1.3
1.4
1.5
0 -40
-20
0
20
40
60
80
100
Forward voltage VF (V)
Ambient temperature Ta (C)
Fig.5 Relative Repetitive Peak OFF-state Voltage vs. Ambient Temperature
1.3 Relative repetitive peak OFF-state voltage VDRM (Tj=Ta) / VDRM (Tj=25C) 1.2
Fig.6 ON-state Voltage vs. Ambient Temperature
2 IT=0.1A 1.9 1.8 ON-state voltage VT (V) 1.7 1.6 1.5 1.4 1.3 1.2 1.1
1.1 1 0.9 0.8 0.7 -40
-20
0
20
40
60
80
100
1 -40
-20
0
20
40
60
80
100
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Sheet No.: D2-A07201EN
6
PC3SH11YFZ Series Fig.7 Holding Current vs. Ambient Temperature
10 VD=6V Repetitive peak OFF-state current IDRM (A) -20 0 20 40 60 80 100
Fig.8 Repetitive Peak OFF-state Current vs. Ambient Temperature
10-5
Holding current IH (mA)
10-6
1
10-7
10-8
0.1 -40
10-9 0 10 20 30 40 50 60 70 80 90 100 Ambient temperature Ta (C) Ambient temperature Ta (C)
Remarks : Please be aware that all data in the graph are just for reference.
Sheet No.: D2-A07201EN
7
PC3SH11YFZ Series Design Considerations Design guide
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less. Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are intended to be used as triggering device for main Triacs. Please ensure that the output rating of these devices will be sufficient for triggering the main output Triac of your choice. Failure to do may result in malfunctions. In phase control applications or where the Phototriac Coupler is being by a pulse signal, please ensure that the pulse width is a minimum of 1ms. For designs that will experience excessive noise or sudden changes in load voltage, please include an appropriate snubber circuit as shown in the below circuit. Please keep in mind that Sharp Phototriac Couplers incorporate superor dV/dt ratings which can often eliminate the need for a snubber circuit.
Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time. In the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should provide at least twice the minimum required triggering current from initial operation.
Recommended Foot Print (reference) SMT Gullwing Lead-form
8.2
Wide SMT Gullwing Lead-form
10.2
2.54
2.54
1.7
2.2
2.2
1.7
(Unit : mm)
Sheet No.: D2-A07201EN
8
PC3SH11YFZ Series Standard Circuit (Medium/High Power Triac Drive Circuit)
PC3SH11YFZ
1 4
Load Triac AC Line
2
3
Note) Please add the snubber circuit according to a condition. Any snubber or varistor used for the above mentioned scenarios should be located as close to the main output triac as possible.
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A07201EN
9
PC3SH11YFZ Series
Manufacturing Guidelines Soldering Method Reflow Soldering:
Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.
(C) 300
Terminal : 260C peak ( package surface : 250C peak)
200
Reflow 220C or more, 60s or less 100 Preheat 150 to 180C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A07201EN
10
PC3SH11YFZ Series Cleaning instructions Solvent cleaning :
Solvent temperature should be 45C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
Presence of ODC
This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A07201EN
11
PC3SH11YFZ Series Package specification Sleeve package 1. Through-Hole or SMT Gullwing Package materials
Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
520
2
6.7
5.8
10.8
(Unit : mm)
2. Wide Through-Hole or Wide SMT Gullwing Package materials
Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
6.35
5.9
10.8
520
2
(Unit : mm)
Sheet No.: D2-A07201EN
12
PC3SH11YFZ Series Tape and Reel package 1. SMT Gullwing Package materials
Carrier tape : PS Cover tape : PET (three layer system) Reel : PS
Carrier tape structure and Dimensions
F E D G C I J
B H A H
Dimensions List A B 16.00.3 7.50.1 H I 0.1 10.4 0.40.05
C 1.750.1 J 4.20.1
D 8.00.1 K 5.10.1
E 2.00.1
(Unit : mm) F G +0.1 4.00.1 1.5-0
Reel structure and Dimensions
e g c d
Dimensions List a b
f a b
5
K
X. MA
330 e 231.0
17.51.5 f 2.00.5
(Unit : mm) c d 1.0 100 130.5 g 2.00.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A07201EN
13
PC3SH11YFZ Series 2. Wide SMT Gullwing Package materials
Carrier tape : PS Cover tape : PET (three layer system) Reel : PS
Carrier tape structure and Dimensions
F E D G C I J
B H A K
Dimensions List A B 24.00.3 11.50.1 H I 0.1 12.4 0.40.05
C 1.750.1 J 4.10.1
D 8.00.1 K 5.10.1
E 2.00.1
(Unit : mm) F G +0.1 4.00.1 1.5-0
Reel structure and Dimensions
e g c d
Dimensions List a b 330 e 231.0 25.51.5 f 2.00.5
5
MA
X.
H
a
f b
(Unit : mm) c d 1.0 100 130.5 g 2.00.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A07201EN
14
PC3SH11YFZ Series Important Notices
* The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
Sheet No.: D2-A07201EN
15

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